Method for manufacturing ceramic substrate and ceramic substrate
US11950360B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Aug 2, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Oct 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by laminating a ceramic green sheet on a shrinkage suppressing green sheet, the shrinkage suppressing green sheet having a planar shrinkage rate in firing smaller than a planar shrinkage rate in firing of the ceramic green sheet; and forming a recessed portion in the mother multilayer body before firing by pressing a recessed portion formation planned region where the recessed portion is to be formed after firing of the mother multilayer body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.