Thin-film acoustic imaging system for imaging through an exterior surface of an electronic device housing
US11950512B2 · kind B2 · utility
1Cited by
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25Claims
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Key dates
| Filing date | Mar 23, 2021 |
| Grant date | Apr 2, 2024 |
| Priority date | — |
| Expiry date | Oct 28, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B2201/70
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.