Support carrier material with a modified resin layer, and the production thereof
US11951719B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2016 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Sep 14, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A carrier material has a resin layer arranged on a side of the carrier material. The resin layer includes a formaldehyde resin, a polymer selected from a group containing polyacrylates, polyepoxides, polyesters, polyurethanes, and long-chain silanols, and at least one silane-containing compound of general formula (I), Ra SiX(4-a), and/or the hydrolysis product thereof, where X is H, OH, or a hydrolyzable residue selected from the group comprising halogen, alkoxy, carboxy, amino, monoalkylamino or dialkylamino, aryloxy, acyloxy, alkylcarbonyl; R is a non-hydrolyzable organic residue R selected from the group comprising alkyl, aryl, alkenyl, substituted and unsubstituted alkynyl, cycloalkyl, which can be interrupted by —O— or —NH—; and where R can have a functional group Q selected from a group containing a hydroxy, ether, amino, monoalkylamino, dialkylamino, anilino, amide, carboxy, mercapto, alkoxy, aldehyde, alkylcarbonyl, epoxide, alkenyl, alkynyl, acryl, acryloxy, methacryl, methacryloxy, cyano, and isocyano group, and a is 0-3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.