Compound for encapsulation film and composition thereof, and film, organic light-emitting device and encapsulation method
US11952450B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2020 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Mar 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/40
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A compound for an encapsulation film and a composition thereof, a film, an organic light-emitting device, and an encapsulation method are provided. The composition comprises the compound, one or more photocurable and thermocurable propenyl compounds, and one or more compounds that produce a free radical and produce an acid under light or heat. The encapsulation film includes the composition as a film of an organic layer. The organic light-emitting device includes the film. The encapsulation method involves encapsulating the organic light-emitting device using the encapsulation film. The composition containing the compound serves as an organic layer. An encapsulation film for the organic light-emitting device is manufactured by repetitively and alternately laminating an inorganic layer and the organic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.