Combined near and mid infrared sensor in a chip scale package
US11953380B2 · kind B2 · utility
0Cited by
14References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2020 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | May 21, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/58
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared (“MIR”) radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.