Device for adjusting position of chamber and plasma process chamber including the same for semiconductor manufacturing
US11955322B2 · kind B2 · utility
0Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2021 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Feb 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32798
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device for a plasma processing chamber includes a base, an upper portion attached to the base and extending transverse to the base, and one or more first through holes defined in the base. The one or more first through holes correspond to one or more openings defined in the plasma processing chamber for attaching the device. The device further includes a second through hole defined in the upper portion, and a gauge located in the second through hole, the gauge configured for recording a position of the plasma processing chamber and a shift in the position of the plasma processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.