Advanced info POP and method of forming thereof
US11955460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2020 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Aug 29, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.