Solid-state imaging device and electronic apparatus
US11955500B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2022 |
| Grant date | Apr 9, 2024 |
| Priority date | — |
| Expiry date | Feb 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/08145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a solid-state imaging device including: a first substrate including a first semiconductor substrate and a first wiring layer, the first semiconductor substrate having a pixel unit with pixels; a second substrate including a second semiconductor substrate and a second wiring layer, the second semiconductor substrate having a circuit with a predetermined function; and a third substrate including a third semiconductor substrate and a third wiring layer, the third semiconductor substrate having a circuit with a predetermined function, the first, second, and third substrates being stacked in this order, the first substrate and the second substrate being bonded together with the first wiring layer and the second wiring layer opposed to each other, a first coupling structure on bonding surfaces of the first substrate and the second substrate, and including an electrode junction structure with electrodes formed on the respective bonding surfaces in direct contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.