Patent · US Active

Method for coating chips

US11955585B2 · kind B2 · utility

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14Claims

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Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventors

Aurélien SUHM · Grenoble, FR
Maxime Argoud · Grenoble, FR

Key dates

Filing date	Mar 2, 2020
Grant date	Apr 9, 2024
Priority date	—
Expiry date	Apr 29, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/96
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for coating chips resting, by a rear face opposite to a front face, on a main face of a support substrate, and separated from each other by an inter-chip space, includes a step of forming a photosensitive coating film covering the front faces and the inter-chip spaces. The method further includes a first photolithographic sequence which comprises an insolation sub-step, and a dissolution sub-step. The sequence leads to a partial removal of the photosensitive coating film so as to maintain the film exclusively at the inter-chip spaces and, advantageously recessed relative to the front faces.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.