Methods to shape a cemented carbide substrate using a laser
US11958133B1 · kind B1 · utility
0Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2019 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Feb 17, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/52
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one or more embodiments, a method includes selecting a cemented carbide substrate from a plurality of cemented carbide substrates in a substrate inventory. Each of the plurality of cemented carbide substrates have a substantially planar top surface. The method also includes emitting a plurality of laser pulses from a laser towards at least the substantially planar top surface of the cemented carbide substrate to ablate selected regions of the cemented carbide substrate thereby forming the cemented carbide substrate into a selected shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.