Polyethylene pouch and the fabrication method thereof
US11958254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2018 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Apr 15, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2439/70
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure is concerned with a method of forming a seal with a polyethylene based film structure. The polyethylene based film structure has at least one layer formed with an oriented polyethylene having a predetermined melting temperature (Tm). A conductive heat sealing device provides heat to form the seal, where a first sealing bar of the conductive heat sealing device operates at a first operating temperature of at least 10 degrees Celsius (° C.) below the Tm of the oriented polyethylene in the polyethylene based film structure and a second sealing bar of the conductive heat sealing device operates at a second operating temperature of at least 15° C. higher than the operating temperature of the first sealing bar. The seal formed with the polyethylene based film structure retains at least 99 percent of its original surface area prior to forming the seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.