Additive manufacturing for personalization or serialization of a substrate
US11958311B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 16, 2022 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Jul 22, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2017/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Techniques for using additive manufacturing for applying personalization or serialization information to a substrate are described herein. The techniques may include providing a base substrate formed from a first material such as polyvinyl chloride, polyester, or polycarbonate and applying, via an additive manufacturing process such as three-dimensional printing, a layer to at least a portion of the base substrate. The layer can include at least one of personalization or serialization information. The layer can be formed from the same material as the substrate or formed from a second material with substantially similar material properties as the substrate material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.