Dielectric materials

US11959007B2 · kind B2 · utility

Assignee

• Merck Patent GmbH · DE

Inventors

• Frank Meyer · Mannheim, DE
• Gregor Larbig · Gelnhausen, DE
• Karsten Koppe · Marl, DE

Key dates

• Filing date: Jan 21, 2019
• Grant date: Apr 16, 2024
• Expiry date: Jan 21, 2039

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09K2219/03
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.