Relating to photonic integrated circuits
US11960118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2020 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Mar 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/544
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates of a photonic integrated and a method of fabricating a photonic integrated chip, PIC, configured for alignment and attachment of a laser diode in a predetermined position in which light from the laser diode is aligned with an input of the PIC; wherein the photonic chip comprises an asymmetric alignment assembly for receiving and aligning the laser diode in the predetermined position; and wherein the input comprises a coupler for receiving a laser beam from the laser diode in use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.