Wafer detection device and wafer detection method using the same
US11961749B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2020 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Mar 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68728
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for detecting whether a wafer is present on a clamping jaw and detecting whether the wafer is parallel to a bottom of the clamping jaw. The device for detecting a wafer comprises: a wafer parallel measuring unit arranged in a CMP cleaning and drying device, and used for emitting a parallel measuring laser beam parallel to the bottom of the clamping jaw and receiving the parallel measuring laser beam; a wafer detection unit used for emitting a wafer detecting laser beam to the wafer and receiving the wafer detecting laser beam; and a detection processing unit electrically connected to the wafer parallel measuring unit and the wafer detection unit, and used for determining whether the wafer is present on the clamping jaw and whether the wafer is parallel to the bottom of the clamping jaw according to the received wafer detecting laser beam and parallel measuring laser beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.