Substrate fixing device
US11961754B2 · kind B2 · utility
0Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2021 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Aug 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/28158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate fixing device includes a baseplate, an electrostatic attraction member, and an electrode pin. The baseplate includes a metallic member in which a through hole is famed. The electrostatic attraction member is over a surface of the baseplate and includes an attraction electrode. The electrode pin is inserted through the through hole to be connected to the attraction electrode. A recess communicating with the through hole is formed in the surface of the metallic member with the through hole being within the recess in a plan view from a direction perpendicular to the surface of the metallic member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.