Systems and methods for laser diode array having integrated microchannel cooling
US11962129B2 · kind B2 · utility
0Cited by
1References
22Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 9, 2021 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Dec 31, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02492
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure relates to a laser diode system. The system may have at least one laser diode emitter having a substrate, at least one laser diode supported on the substrate, and a facet which a laser beam generated by the laser diode is emitted. A cooling subsystem is included which is disposed in contact with the substrate of the laser diode emitter. The cooling subsystem includes a plurality of cooling fins forming a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter. The cooling fluid also flows over the facet of the laser diode emitter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.