Variable polyimide thickness to control pad impedance
US11962881B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2022 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Apr 12, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising a conductive layer and an electrical grounding. The conductive layer may include a signal pad region and a signal trace region. A distance between at least one section of the signal pad region and the electrical grounding may be greater than a distance between at least a section of the signal trace region and the electrical grounding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.