PCB for heatsink based power delivery
US11963289B2 · kind B2 · utility
0Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2022 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Oct 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10962
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) includes an array of signal pads on a first surface of the PCB, a power contact pad on the first surface, and a ground contact pad on a second surface of the PCB. Each signal pad of the array of signal pads is associated with a signal contact of a central processing unit (CPU). The power contact pad provides power for the CPU apart from the array of signal pads. The ground contact pad provides a ground for the CPU apart from the array of signal pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.