Circuit apparatus, manufacturing method thereof and circuit system
US11963295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2022 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | May 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.