Fluororesin composition, fluororesin sheet, laminate and substrate for circuits
US11963297B2 · kind B2 · utility
1Cited by
1References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 24, 2019 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Apr 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/029
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.