Vacuum-assisted BGA joint formation
US11963307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2021 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Mar 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/176
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.