Component carrier having component covered with ultra-thin transition layer
US11963310B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2020 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Dec 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a component carrier includes providing a laminated stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least partially covering a component with a transition layer having a thickness in a range from 0.5 nm to 1 μm, and assembling the component with the stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.