Heatsink with a sandwich plate construction
US11963335B2 · kind B2 · utility
1Cited by
0References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2020 |
| Grant date | Apr 16, 2024 |
| Priority date | — |
| Expiry date | Aug 15, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Particular embodiments described herein provide for an electronic device that can be configured to include a sandwich plate construction heatsink. The sandwich plate construction heatsink can include a cold plate, one or more heat pipes over the cold plate, and a top plate over the one or more heat pipes. The cold plate can include a channel to accommodate the one or more heat pipes and/or the top plate can include a channel to accommodate the one or more heat pipes. The cold plate can be over a heat source in the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.