Glass substrate having through hole and hollowed-out portion and method for producing the same
US11964344B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Dec 14, 2020 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Apr 19, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A glass substrate for a semiconductor package includes a first principal surface, a second principal surface, at least one hollowed-out portion, and at least one through hole formed in a surrounding of the at least one hollowed-out portion, wherein in a section of the at least one hollowed-out portion taken in a direction perpendicular to the first principal surface, a minimum diameter of the at least one hollowed-out portion is smaller than an opening diameter of the at least one hollowed-out portion at each of the first principal surface and the second principal surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.