Three-dimensional molding method
US11964438B1 · kind B1 · utility
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28References
14Claims
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Key dates
| Filing date | Sep 29, 2023 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Sep 29, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional molding method in which both a support material 2 and a test piece 3 are separately joined to partial regions of a part to be produced 1, which is molded by dispersion of a powder by traveling of a squeegee and sintering of the powder by irradiation of a laser beam or an electron beam, or the test piece 3 is separately joined to a plurality of the support materials 2, or the test piece 3 is joined to a partial region of the part to be produced 1 to mold the support material 2 and the test pieces 3 in the same step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.