Method of forming an etched part and a method of forming a metal plated part
US11965045B2 · kind B2 · utility
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4References
20Claims
0Family size
Assignee
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Key dates
| Filing date | May 18, 2023 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | May 18, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y70/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of forming an etched part includes forming a substrate including a thermoset resin and etching a surface of the substrate. The thermoset resin includes a vat photopolymerization (VPP) thermoset resin and at least one of an etchable phase and etchable particles disposed within the VPP thermoset resin. The etching removes the etchable phase from the VPP thermoset resin at the surface of the substrate such that a plurality of micro-mechanical bonding sites are formed on an etched surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.