Systems and methods of testing adverse device conditions
US11965927B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2019 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Oct 1, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Thermal conditions can be simulated for an electronic device. Application developers may want to test how applications perform under various thermal conditions on a device that includes thermal management. The application developers can use the tests to determine whether the application should take proactive measures to maintain application performance, and which proactive measures should be taken. For example, an application can reduce its use of resources to ensure that an application maintains a desired quality of user experience (and at a minimum remains responsive) under adverse thermal conditions. Creating adverse conditions can be difficult to replicate, costly to implement, and can potential cause damage to the electronic device being tested. In some examples, simulating thermal conditions can be used instead of placing the device in real-world adverse conditions to improve the testing process for developers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.