Hybrid circuit thermal test vehicles, systems, and methods
US11965928B1 · kind B1 · utility
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20Claims
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Key dates
| Filing date | Aug 24, 2021 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Jul 2, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/016
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A disclosed Thermal Test Vehicle (TTV) for simulating the thermal characteristics of a certain integrated circuit may include (1) a substrate that serves as both (A) an electrical insulator that resists electrical energy and (B) a thermal conductor that conducts thermal energy and (2) one or more resistive elements coupled to the substrate, wherein the resistive elements extend across a majority of at least one dimension of the substrate. Various other apparatuses, systems, and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.