Thermo-electric cooling headsets
US11966267B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2019 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Dec 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R5/033
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one example in accordance with the present disclosure, a headset is described. The headset includes a sensory input device and a pad surrounding the sensory input device. The pad includes a thermo-electric cooling (TEC) device having a first side and a second side. The first side is to cool and the second side is to heat when a voltage is applied to the TEC device. The pad also includes a cooling layer in contact with the first side of the TEC device and a heat spreading layer in contact with the second side of the TEC device. The pad also includes an enclosing material enveloping the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.