Touch substrate, touch substrate manufacturing method, touch module and manufacturing method for touch module
US11966552B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 4, 2022 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Mar 4, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A touch substrate manufacturing method, for manufacturing a target touch substrate to be assembled with a display substrate, is provided. A size of an active display region of the display substrate is a first preset size. The method includes: providing a touch substrate to be processed having a second preset size, the second preset size being greater than the first preset size; and cutting, in at least one cutting direction, the touch substrate to be processed to obtain the target touch substrate, the cutting direction being parallel to an extending direction of a touch channel on the touch substrate to be processed. A manufacturing method for touch module, a touch substrate and a touch module are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.