Chip resistor and method of manufacturing chip resistor
US11967443B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 4, 2022 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Oct 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip resistor includes: an insulating substrate; a pair of front electrodes; a resistor connecting between both the front electrodes; an undercoat layer provided on the resistor; an overcoat layer provided on the undercoat layer, an auxiliary film provided so as to be over a connecting portion between the front electrode and the resistor at a position away from an end face of the insulating substrate; a pair of end face electrodes; and a pair of external plating layers covering the end face electrodes, the front electrodes, and the auxiliary film, wherein the auxiliary film is formed of a resin material containing metal particles, and a portion of the auxiliary film is sandwiched between the undercoat layer and the overcoat layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.