Sensor element and method for producing a sensor element

US11967444B2 · kind B2 · utility

Assignee

• TDK Electronics AG · JP

Inventors

• Jan Ihle · Grambach, AT
• Thomas Bernert · Freiland bei Deutschlandsberg, AT
• Gerald Kloiber · Feldkirchen in Kärnten, AT

Key dates

• Filing date: Sep 15, 2020
• Grant date: Apr 23, 2024
• Expiry date: Sep 15, 2040

Classification

• Technology area (CPC —): General

Abstract

In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.