Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits
US11967569B2 · kind B2 · utility
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24Claims
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Key dates
| Filing date | Dec 17, 2021 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Dec 17, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/42
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.