Output-integrated transistor device packages
US11967936B2 · kind B2 · utility
0Cited by
11References
23Claims
0Family size
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Key dates
| Filing date | May 6, 2021 |
| Grant date | Apr 23, 2024 |
| Priority date | — |
| Expiry date | Jun 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a plurality of input leads, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combined output lead configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.