Method for mechanical packaging for modular energy system

US11968776B2 · kind B2 · utility

Assignee

• Cilag GmbH International · CH

Inventors

• Madeleine C. Jayme · Cincinnati, US
• Ryan M. Asher · Cincinnati, US
• William B. Weisenburgh, II · Maineville, US
• Joshua E. Henderson · Cincinnati, US
• Stephen D. Geresy · West Chester, US
• Stephen M. Leuck · Milford, US
• John A. Weed, III · Monroe, US
• Brendan J. Oberkircher · Cincinnati, US
• Kristen G. Denzinger · Cincinnati, US

Key dates

• Filing date: Mar 30, 2021
• Grant date: Apr 23, 2024
• Expiry date: Nov 15, 2041

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49208
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

Disclosed is a method of assembling a backplane connector subassembly for a module of a modular energy system. The backplane connector subassembly physically and electrically connects at least two modules stacked on top of one another. The method includes providing a back panel defining an inner surface, attaching a first support member to the inner surface of the back panel, attaching a second support member to the inner surface of the back panel, attaching the upstream connector to the back panel by sliding a first mating hole defined in the upstream connector onto the first support member, and attaching the downstream connector to the back panel by a sliding a second mating hole defined in the downstream connector onto the second support member. The first support member is configured to support an upstream connector. The second support member is configured to support a downstream connector.