Method and device for milling large-diameter aspheric surface by using splicing method and polishing method
US11969805B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2020 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Nov 17, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B51/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and device for milling a large-diameter aspheric surface by using a splicing method and a polishing method to solve the problems of large time consumption and serious tool wear in the machining of a meter-scale large-diameter aspheric surface are disclosed. where an aspheric surface is discretized into a series of rings with different radii, and the rings are sequentially machined via generating cutting by using an annular grinding wheel tool with an outer diameter less than ¼ of a diameter of the aspheric surface; the rings are equally spaced, there are a total of N rings, and a width of any ring is jointly determined by the Nth ring, the (N−1)th ring, positioning accuracy and a generatrix equation of the aspheric surface; and the aspheric surface is enveloped by a large number of rings. A contact area between the tool and a workpiece surface is rings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.