Method of manufacturing sensor
US11969919B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2019 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Feb 2, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/752
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided is a method of manufacturing a sensor. The sensor has a casing having an opening portion, a clamp having a recessed part on its outer periphery and having one end inserted into the opening portion, and a sealing ring attached to the recessed part and disposed between the casing and the clamp. The method includes using a first divided mold to form a first component of the clamp, the first component including a main body portion and a first part located at one end side of the main body portion and forming a part of the recessed part. The first divided mold is divided so that a dividing surface intersects the main body portion and separates in an axial direction of the main body portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.