Method for manufacturing a floor board
US11970020B2 · kind B2 · utility
2Cited by
62References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 23, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Jul 16, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB44F9/02
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing a floor board comprises the steps of supplying a panel, printing a curable substance or surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern, respectively, and curing the curable substance or removing any reaction products of the surface removing substance and the panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.