Interface system for interconnected die and MPU and communication method thereof

US11971446B2 · kind B2 · utility

Inventors

• Jinghe Wei · 安丰镇, CN
• Letian Huang · 安丰镇, CN
• Zhiqiang Xiao · 安丰镇, CN
• Mingang Feng · 安丰镇, CN
• Taojie Ding · 安丰镇, CN
• Lihua Zheng · Tangxia, CN

Key dates

• Filing date: Dec 16, 2021
• Grant date: Apr 30, 2024
• Expiry date: May 21, 2042

Classification

• Technology area (CPC G): Physics
• CPC primary: G06F15/7825
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The invention discloses an interface system for an interconnected die and an MPU and a communication method thereof. The system comprises a data interface, an interrupt interface, and a debugging interface; the data interface comprises an SPI interface, a DDR data interface, and a DMA control interface; the interrupt interface is used for receiving an interrupt data packet from the network and parsing the interrupt data packet to obtain a pulse interrupt input required by the MPU; the debugging interface comprises a JTAG-Core debugging interface, which is used for receiving a debugging data packet from the network and translating the debugging data packet into a JTAG protocol for MPU debugging. The invention realizes the expansion of the master device MPU in the high-performance information processing microsystem and the high-speed communication between the master device and the interconnected dies.