High-frequency module

US11971502B2 · kind B2 · utility

Assignee

• Endress+Hauser SE+Co. KG · DE

Inventors

• Martin Hitzler · Dillingen/Saar, DE
• Winfried Mayer · Hobrechtsfelde, DE

Key dates

• Filing date: Jun 13, 2019
• Grant date: Apr 30, 2024
• Expiry date: Jun 30, 2040

Classification

• Technology area (CPC G): Physics
• CPC primary: G01S13/88
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Disclosed is a high frequency module for producing or processing radar signals for use in radar-based fill-level measuring devices. The high frequency module includes: a semiconductor component to produce or to process electrical, high frequency signals; a dielectric coupling element contacted with the semiconductor component to couple the high frequency signals as radar signals into a dielectric waveguide or in order to couple radar signals from the waveguide as electrical, high frequency signals into the semiconductor component. The coupling element and the waveguide form a plug contact. In the case of appropriate design of the plug contact there results upon plug-in a self-centering, so that need for a complex adjustment during manufacturing is absent. Since radar frequencies of above 100 GHz can be produced by the semiconductor component, corresponding fill level measuring devices are characterized by a high measuring resolution and compact structures.