Thermal mapping
US11971699B2 · kind B2 · utility
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3References
14Claims
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Key dates
| Filing date | Oct 29, 2018 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Apr 11, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Examples of methods for thermal mapping by an electronic device are described herein. In some examples, a map is obtained. In some examples, a first thermal image at a first resolution is obtained. In some examples, a neural network is used to determine a second thermal image at a second resolution based on the map and the first thermal image. The second resolution is greater than the first resolution in some examples.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.