Wire waterproof structure
US11972880B2 · kind B2 · utility
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0References
20Claims
0Family size
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Key dates
| Filing date | Mar 6, 2019 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | May 19, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02G15/043
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wire waterproof structure including a water-stopping material, wherein: the water-stopping material is configured to seal at least a partial region of a conductor comprising an assembly of a plurality of strands, the water-stopping material contains a resin material, and a filler dispersed in the resin material, and the filler has an average particle size of 1 μm or more and 15% or less of an outer diameter of the strands, and a content in the water-stopping material of 1 mass % or more and 20 mass % or less, relative to the resin material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.