Wafer transfer module and method thereof for transferring to-be-transferred wafer
US11972963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2021 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Oct 27, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45032
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application relates to a wafer transfer module in a semiconductor manufacturing machine, relating to semiconductor integrated circuit manufacturing machines, wherein two sets of transmitter/receivers are provide on sidewalls of the wafer transfer module to monitor the travel position of an elevator, two sets of transmitter/receivers are provide on the sidewalls of the wafer transfer module to monitor the position of a transfer arm, a signal received by the receiver is transmitted to a control system such that the control system determines, according to the travel position of the elevator and the transfer arm position, whether the transfer arm can obtain a to-be-transferred wafer, thereby preventing the problem of a wafer scratch caused by an elevator position deviation or a transfer arm position deviation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.