Mechanical architecture for a multi-chip module
US11973004B2 · kind B2 · utility
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9Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 19, 2019 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Nov 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described is a multi-chip module that may include a Redistribution Layer (RDL) substrate having Integrated Circuit (IC) dies mounted to a first surface of the RDL substrate. A second plurality of IC dies may be mounted to an opposite second surface. A plurality of sockets can be mounted upon the second plurality of IC dies and a cold plate then mounted to the first plurality of IC dies. The mounting structure may include socket frames coupled to the plurality of sockets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.