Coplanar control for film-type thermal interface
US11973005B2 · kind B2 · utility
0Cited by
12References
20Claims
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Key dates
| Filing date | Aug 3, 2021 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Jan 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.