Method for transferring electronic device
US11973054B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2022 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Jan 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/951
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.