Method of manufacturing light emitting device
US11973165B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 2021 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Jan 18, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a light emitting device includes: preparing a light-shielding frame defining a through-hole, and having at least one convex portion; supplying a light reflecting resin so that the convex portion is at least partially covered; preparing a light-transmissive member having a first surface with an outer periphery smaller than an inner periphery of the first main surface, a first side surface contiguous with the first surface, a second side surface located outside of the first side surface, and a third surface contiguous with the first and second side surfaces; bringing the third surface into contact with the convex portion, or with the light reflecting resin in contact with the convex portion, so that the light reflecting resin is disposed between the first side surface and an inside surface of the light-shielding frame; curing the light reflecting resin; and joining light emitting elements and the light-transmissive member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.