Multi-layered air waveguide antenna with layer-to-layer connections
US11973268B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2021 |
| Grant date | Apr 30, 2024 |
| Priority date | — |
| Expiry date | Jul 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0087
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
This document describes techniques, apparatuses, and systems for a multi-layer air waveguide with layer-to-layer connections. Each pre-formed layer of the air waveguide is attached to at least one other pre-formed layer by a mechanical interface. The mechanical interface may be a stud-based interface, a snap fastener-based interface, a ball-and-socket based interface, or a pressure contact interface utilizing irregular roughed surfaces of each pre-formed layer. The mechanical interfaces of the pre-formed layers structurally hold the air waveguide together and electrically couple all of the pre-formed layers. In this manner, the cost of manufacturing the air waveguide antennas may be less expensive than previous manufacturing processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.