Diode laser assembly and method for producing a diode laser assembly

US11973313B2 · kind B2 · utility

Assignee

• TRUMPF Photonics, Inc. · US

Inventors

• Stephan Strohmaier · Berlin, DE
• Arne-Heike Meissner-Schenk · Berlin, DE
• Gerald Urban · Neuzelle, DE
• Gerd Hansen · Berlin, DE
• Christian Carstens · Bad Honnef, DE

Key dates

• Filing date: Jun 18, 2019
• Grant date: Apr 30, 2024
• Expiry date: Apr 10, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/02476
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A diode laser arrangement includes at least one emitter, first and second cooling devices and a first connecting layer. The emitter is configured to emit a laser beam and is disposed between the first and second cooling devices. The first and second cooling devices are each configured for cooling the emitter. The emitter is connected to the first cooling device by the first connecting layer, and the first connecting layer has a connecting material or is composed of a connecting material selected from a group including gold, a gold alloy, silver, a silver alloy, a silver sintered material, copper, a copper alloy, nickel, a nickel alloy, palladium, a palladium alloy, platinum, a platinum alloy, rhodium, a rhodium alloy, iridium, an iridium alloy, germanium, a germanium alloy, tin, a tin alloy, aluminum, an aluminum alloy, indium, an indium alloy, lead and a lead alloy.